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The 3rd International Conference on Integrated Circuits and Devices in Vietnam (ICDV 2012)

Location: Danang University of Technology, Danang, Vietnam

Date: August 13, 2012 (Monday) – August 15, 2012 (Wednesday)

Co-organized by VNU University of Engineering and Technology, Danang University of Technology
Sponsored by IEICE Electronics Society Technical Committee on Integrated Circuits and Devices
Co-sponsored by IEEE SSCS Japan Chapter, IEEE SSCS Kansai Chapter, and The Radio-Electronics Association of Vietnam (REV)

The ICDV (Integrated Circuits and Devices in Vietnam) is an annual international forum for presenting chips and circuit designs in solid-state and semiconductor fields. Continuous scaling of the CMOS devices increases the number of transistors on a VLSI chip. It will soon reach the level of 10 giga transistors on a single chip, which is equivalent to the total neuron numbers in the human brain. This would certainly provide us a great opportunity for new applications and information processing. On the other hands, the small feature size causes new problems such as leakage current and process variation. To discuss utilizing the scaling advantages and coping with the new problems, we call for contributions about new proposal of application systems, VLSI architectures, and design methodologies as well as the technologies in the integrated circuit and device field. We expect to this conference explores and stimulates the contributed researches to those subjects. The papers are solicited from prospective authors interested in the related fields. The ICDV 2012 conference is supported by the IEICE ICD technical group, co-organized by VNU University of Engineering and Technology (VNU-UET) and Danang University of Technology (DUT), and will be held in Danang city, Vietnam. In this part of Central of Vietnam, you will also enjoy a coastal mix of the dynamic and booming city of Danang, the charm of the world heritage ancient town of Hoi An, and the calm of world heritage monuments of the imperial capital of Hue. Further details on the workshop, paper submission guidelines, and templates will be updated on the ICDV website.

Paper Submission

Prospective authors are invited to submit full-length, six-page manuscripts, including figures, tables and references, to the official ICDV 2012 website. All papers will be handled electronically. Accepted and presented papers will be included in the conference proceedings published by the IEICE and will be invited to submit to REV Journal on Electronics and Communications (JEC). Papers are solicited in the following categories, but are not limited to:

  1. Digital integrated circuits and signal processing
  2. Processors/ multiprocessors
  3. Memory
  4. Analog and mixed-signal circuits
  5. RF integrated circuits and microwave engineering
  6. Circuit technologies
  7. Design experience with advanced design technology
  8. Circuits/devices modeling, verification and testing
  9. Reconfigurable architectures
  10. FPGA-based designs
  11. Embedded systems design
  12. Applications related to integrated circuits and devices

Important dates

  • Manuscript submission: May 1, 2012 May 22, 2012
  • Notification of acceptance: June 15, 2012 June 30, 2012
  • Camera-ready submission: June 30, 2012 July 10, 2012

Contact information

  • E-mail: